Product Introduction
The ultrasonic indium coater uses high-frequency ultrasonic vibration energy to spread molten indium evenly on substrate surfaces and form a tightly bonded indium interface layer. It is a flux-free indium coating solution for thermal interface preparation and dissimilar-material bonding in semiconductor and optoelectronic applications.
Compared with manual scraping and plating processes, it supports uniform, dense indium layers with low void rate. The process runs near room temperature to minimize thermal deformation of precision workpieces. It supports both fixed-area coating and scanning coating for sputtering targets, heat sinks, laser components, and other high-reliability thermal interfaces.
